Thermal pads

Thermal gap pads are most commonly used to bridge components to a heat sink or chassis.

Typical Applications Include:

• Mass storage devices
• Telecommunications hardware
• Notebook computers
• Power supplies

All OpTIMTM Thermal Gap Pads are RoHS and REACH compliant and halogen free.
Custom die cut parts are readily available.
Custom configurations are available on request.
Higher performance material generally has a higher cost.
Fiberglass carrier is strongly recommended for thickness less than .030″.

The higher the thermal performance the less electrically isolative the material is. Added features (adhesives etc.) negatively affect thermal performance and cost.